NVIDIA
Senior Package Modeling Engineer
$124K–$224K
US, CA, Santa Clara · Senior · Full-time · Posted Sep 10, 2026
- Experience
- 5+ years of FEA modeling/simulation experience.
- Education
- MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or related field.
About the job
Conducts finite element modeling and reliability analysis to guide advanced semiconductor package design, materials, and manufacturing decisions.
What you'll do
- Run FEA to assess stress, warpage, and thermo-mechanical behavior in semiconductor packages.
- Evaluate materials, interconnects, and processes for package reliability and contribute to technology roadmaps.
- Establish modeling methods, interpret results, mentor collaborators, and document and present findings.
What they ask for
- MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or a related field.
- 5+ years of FEA modeling/simulation experience.
- Strong expertise in FEA tools (ANSYS, Abaqus, COMSOL, or equivalent).
- Knowledge of thermal-mechanical interactions and reliability failure modes; familiarity with JEDEC standards, accelerated life testing, and advanced semiconductor packaging.
Pay
124,000 USD - 195,500 USD base salary (Level 3); 140,000 USD - 224,250 USD base salary (Level 4)
Tools
FEA, ANSYS, Abaqus, COMSOL, JEDEC, flip-chip, 2.5D/3D IC, CoWoS-R
Model-written summary · the original posting is authoritative