NVIDIA
Senior Packaging Technical Engineer - Hardware
$168K–$322K
US, CA, Santa Clara +2 · Senior · Full-time · Posted Aug 18, 2026
- Location
- US, CA, Santa Clara
US, TX, Remote
US, Remote - Experience
- Minimum of 8+ years in board/system design; package design experience is preferred.
- Education
- BSEE or equivalent experience.
About the job
Designs chip pad rings, substrate interconnects, and package layouts to deliver robust electrical packages.
What you'll do
- Define and implement chip pad rings, substrate interconnect schemes, and package layouts.
- Define chip floor plans, pad rings, substrates, and ball-outs in collaboration with engineering teams.
- Communicate with teams across the company.
What they ask for
- BSEE or equivalent experience.
- At least 8 years in board/system design.
- Good understanding of transmission line theory, power delivery, and signal integrity is desired.
- Able to work with minimal supervision and solve complex technical problems.
Nice to have
- Package design experience.
- Programming or scripting with Perl, Python, or Tcl; familiarity with Cadence Skill and EXCEL.
Pay
168,000 USD - 258,750 USD (base salary, Level 4); 200,000 USD - 322,000 USD (base salary, Level 5)
Tools
Perl, Python, Tcl, Cadence Skill, EXCEL
Model-written summary · the original posting is authoritative