OLIX
Packaging Architect
Austin, TX +2 · On-site · Full-time · Posted Oct 28, 2026
- Location
- Austin, TX
London, UK
Bristol, UK - Experience
- 10+ years' experience in advanced semiconductor packaging for ASIC or other high-performance products.
- Education
- Degree in a relevant engineering or physical sciences discipline.
About the job
Own OLIX’s packaging architecture and roadmap, lead end-to-end package development for the DX-1 accelerator, and establish capabilities for future products.
What you'll do
- Lead package architecture, design, layout, simulation, verification, release, and manufacturing support for DX-1 and future products.
- Build packaging methods, tools, partner relationships, and— as the program scales—a packaging engineering team.
- Coordinate with ASIC, optics, mechanical, thermal, systems, and manufacturing partners to meet product, reliability, and production requirements.
What they ask for
- 10+ years' experience in advanced semiconductor packaging for ASIC or other high-performance products.
- Demonstrated ownership of packaging architecture, technology strategy, or roadmap development for complex products.
- Deep expertise in ASIC-to-substrate integration and strong experience with 2.5D and/or 3D package architectures, including multi-die and heterogeneous integration.
- Hands-on package design and PI/SI simulation experience, plus experience leading package development across layout, simulation, verification, and release.
Nice to have
- Experience with AI accelerators, high-performance compute, networking, or advanced data-centre hardware.
- Exposure to optical or photonic integration with electronic packaging.
Tools
Cadence Allegro X APD, Siemens Xpedition, Ansys SIwave, Cadence Sigrity
AI focus
Packaging architecture and integration for the DX-1 AI decode accelerator and future products.
Model-written summary · the original posting is authoritative