Qualcomm
#Agentic AI Windows Power and Thermal Engineer
$100K–$149K
San Diego, California · On-site · Full-time · Posted Sep 17, 2026
- Education
- Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
- Visa sponsorship
- Not eligible for Qualcomm immigration sponsorship.
About the job
Develop system-level power and thermal software solutions for Qualcomm chipsets, including AI-driven infrastructure that analyzes telemetry to optimize power and performance.
What you'll do
- Profile power and thermal behavior, identify power, thermal, and peak-current risks, and develop mitigations with cross-functional teams.
- Design, train, and deploy neural network models and automate telemetry processing to optimize power and performance.
- Develop competitive-analysis tools and methodologies and devise thermal mitigation schemes.
What they ask for
- Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
Nice to have
- Systems/HW background, including microprocessor architecture and common SoC hardware blocks.
- AI expertise in model development, data pipeline management, or infrastructure automation.
Pay
$99,500.00 - $149,300.00 USD base salary
Tools
CNNs, LLMs, Transformers, JTAG debugger, oscilloscopes, logic analyzers
AI focus
Design, train, and deploy neural network architectures and build end-to-end infrastructure automation to process power, performance, and log telemetry for optimization.
Model-written summary · the original posting is authoritative