Drimva

Qualcomm

Connectivity Project Engineer, Principal

$200K–$300K

San Diego, California · On-site · Principal · Full-time · Posted Sep 17, 2026

Experience
15 years in semiconductor product development; more than 10 years in one or more semiconductor product development areas; more than 5 years in a technical leadership role; five or more years in engineering trade-off analysis.
Education
Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC-related experience; or Master's degree in Science, Engineering, or related field and 7+ years; or PhD in Science, Engineering, or related field and 6+ years.

About the job

Leads cross-functional planning and execution of data-center chipset development from concept through commercialization, ensuring performance, schedule, and cost goals are met.

What you'll do

  • Oversee chipset development and coordinate with domain experts to meet key performance indicators, including PPA, schedule, and cost.
  • Drive resolution of engineering issues across chipset subsystems; identify and mitigate project risks and process gaps.
  • Plan and communicate program status, progress, gaps, and risks to senior management.

What they ask for

  • Expertise in architecting, designing, and/or validating high-performance solutions across multiple functional areas of high-performance SoCs.
  • Experience commercializing chipsets, such as post-silicon validation, power and thermal convergence, silicon characterization and test, or compliance certifications.
  • Five or more years of experience in engineering trade-off analysis.
  • Demonstrated track record in hyperscale data center solutions.

Nice to have

  • Experience developing high-speed Ethernet or PCIe SerDes IP, or SerDes-based Ethernet or PCIe products.

Pay

$200,000.00 - $300,000.00 (USD, base salary)

Tools

SoC, SerDes, DDR, Ethernet, PCIe

Model-written summary · the original posting is authoritative

First seen Oct 28, 2026 · Last verified Nov 5, 2026 (UTC)