Qualcomm
Director, IC Packaging Engineering – Mechanical Simulation
$227K–$341K
San Diego, California · On-site · Director · Full-time · Posted Sep 17, 2026
- Experience
- 8+ years with a bachelor’s degree, 7+ years with a master’s degree, or 6+ years with a PhD; preferred: 12+ years in FEA modeling and analysis and 5+ years of direct people management.
- Education
- Bachelor’s, master’s, or PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field.
About the job
Leads Qualcomm’s mechanical simulation team, delivering and improving FEA analysis for IC packages and advanced packaging programs.
What you'll do
- Set team direction, develop talent, and manage cross-functional relationships across package design, NPI, assembly, and CPI teams.
- Oversee development and validation of mechanical FEA models and guide analysis of warpage, solder joint reliability, assembly processes, and package-board interactions.
- Advance simulation methodologies, best practices, workflows, automation, and tooling.
What they ask for
- Bachelor’s degree in Chemical, Electrical, or Mechanical Engineering, or a related field, with 8+ years of related work experience; or a master’s degree with 7+ years; or a PhD with 6+ years.
- Experience in System/Package Design/Technology Engineering or related work.
Nice to have
- Ph.D. in Mechanical Engineering, Materials Science, Electrical/Microelectronics Engineering, or a related field.
- 12+ years in FEA modeling and analysis for IC electronic packaging and interconnects; 5+ years of direct people management, including managing managers or senior technical staff.
Pay
$227,200.00 - $340,800.00 USD (base salary)
Tools
ANSYS APDL, OptiSLang
Model-written summary · the original posting is authoritative