Qualcomm
Mechanical Engineer, Senior Staff
$170K–$255K
San Diego, California · On-site · Senior Staff · Full-time · Posted Oct 30, 2026
- Experience
- 15+ years in thermomechanical design; 3+ years in liquid cooling. The posting also lists generic minimum qualifications of 6+ years with a bachelor’s degree, 5+ years with a master’s degree, or 4+ years with a PhD in a related field.
- Education
- Bachelor’s degree in Mechanical, Thermal, Hardware Engineering, or a closely related engineering discipline.
About the job
Leads thermomechanical design and analysis of liquid-cooled data center systems, supporting decisions across server, rack, and pod architectures.
What you'll do
- Model thermal performance and liquid flow at package, server, rack, and pod levels; provide analysis of performance, risk, cost, and feasibility.
- Lead external partner engagements and support development and validation of cooling solutions with ODMs, OEMs, suppliers, and internal teams.
- Conduct CFD simulations, improve analysis methods, and apply practical mechanical engineering judgment to ensure designs are manufacturable and reliable.
What they ask for
- Bachelor’s degree in Mechanical, Thermal, Hardware Engineering, or a closely related engineering discipline.
- 15+ years in thermomechanical design and a portfolio of shipped products.
- 3+ years of liquid cooling experience with high-power-density, high-efficiency coolers, manifolds, and connections.
- Advanced, expert-level skill in one or more CFD tools; experience working with ODMs and OEMs across the server/rack ecosystem.
Nice to have
- Experience with OCP rack and server architectures, including ORV3 / Open Rack Wide; data center rack-level and system-level thermal design.
- Experience with AI/accelerator or other high-power-density compute platforms; microfluidic cooling technologies.
Pay
$169,800.00 - $254,600.00 USD (pay range; salary/base pay)
Tools
CFD, ANSYS Fluent, Ansys AEDT, ANSYS Icepak, STAR-CCM+, FloEFD, FloTHERM, OpenFOAM
AI focus
Supports thermomechanical design and cooling analysis for AI inference systems and AI/accelerator platforms.
Model-written summary · the original posting is authoritative