Qualcomm
Mechanical Engineering Internship – Summer 2027
San Diego, California +2 · On-site · Internship · Posted Sep 18, 2026
- Location
- San Diego, California
Austin, Texas
Santa Clara, California - Experience
- 1+ years of academic experience with programming languages such as Python, Matlab.
- Education
- Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in mechanical engineering, materials science, or a related field.
- Visa sponsorship
- The aligned potential role is not eligible for Qualcomm immigration sponsorship. An export license may be required for candidates with citizenship in certain listed countries.
About the job
Designs, simulates, and tests mechanical and thermal systems supporting semiconductor technologies, with projects potentially involving packaging, thermal modeling, and cooling solutions.
What you'll do
- Design, simulate, and test mechanical and thermal systems.
- Contribute to team projects involving IC packaging, chip/package co-design, thermal modeling, signal and power integrity, or cooling solutions.
What they ask for
- Currently enrolled in a bachelor’s, master’s, or Ph.D. program in mechanical engineering, materials science, or a related field.
- Available for 11–14 weeks during Summer 2027 (May–September).
- Expected graduation date of November 2027 or later.
- 1+ years of academic experience with programming languages such as Python, Matlab.
Nice to have
- Familiarity with Cadence Sip, AutoCAD, and Solidworks.
- Relevant coursework or experience in mechanics, FEA, IC packaging, thermal design, microelectronics, CFD, or airflow testing.
Pay
$17.00 - $98.00 USD (pay range; hourly rate not specified)
Tools
Python, Matlab, Cadence Sip, AutoCAD, Solidworks, Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD)
Model-written summary · the original posting is authoritative