Qualcomm
Packaging SIPI Engineer, Principal Engineer
$210K–$315K
San Diego, California · On-site · Principal · Full-time · Posted Sep 17, 2026
- Experience
- 8+ years with a bachelor's degree, 7+ years with a master's degree, or 6+ years with a PhD; preferred: 10+ years in high-speed SerDes package, PCB, or system design.
- Education
- Bachelor's, master's, or PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
About the job
Performs signal and power integrity analysis, electrical model and package extraction, and system-level simulations for high-speed computing and server designs.
What you'll do
- Extract models and perform IO analysis, simulations, and reporting.
- Analyze IO power distribution for product development and reference systems.
- Perform package extraction for time- and frequency-domain analysis and provide package design guidelines.
What they ask for
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of relevant experience; or master's degree and 7+ years; or PhD and 6+ years.
- Relevant experience in System/Package Design/Technology Engineering or related work.
Nice to have
- 10+ years of experience with high-speed SerDes package, PCB, or system design for computing/server standards; strong background in electromagnetics, transmission line theory, and crosstalk.
- Experience with field solvers and SPICE tools, SerDes specifications, MATLAB automation, or C/C++/Perl/Python.
Pay
$210,000.00 - $315,000.00 (base salary)
Tools
HFSS, Q3D, Sentinel-PSI, Clarity, ADS, HSPICE, MATLAB, C/C++
Model-written summary · the original posting is authoritative