Qualcomm
Packaging SIPI Engineer, Sr. Staff
$192K–$288K
San Diego, California · On-site · Senior Staff · Full-time · Posted Oct 16, 2026
- Experience
- 6+ years with a bachelor’s degree, 5+ years with a master’s degree, or 4+ years with a PhD; preferred qualifications also mention 15+ years with a master’s or PhD and 10 years in DDR/SerDes package, PCB, or system design for compute/server standards.
- Education
- Bachelor's, master’s, or PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
About the job
Leads package signal- and power-integrity engineering for automotive products, optimizing package designs through extraction and system-level simulation before tape-out.
What you'll do
- Perform package extraction and time- and frequency-domain analysis, including system-level analysis for DDR, SerDes, and mixed-signal interfaces.
- Develop package design guidelines, simulation and analysis flows, and automation; provide feedback for design optimization.
- Lead engineers across international locations and collaborate with PHY, package, and PCB teams; create technical documentation and presentations.
What they ask for
- Bachelor’s degree in Chemical, Electrical, or Mechanical Engineering, or a related field, plus 6+ years of relevant experience; or a master’s degree plus 5+ years; or a PhD plus 4+ years.
- Experience in System/Package Design/Technology Engineering or related work.
Nice to have
- Experience in automotive package design and analysis; prior management experience.
- Ability to use AI to enhance team efficiency; experience with SerDes specifications, MATLAB automation, programming or scripting, electromagnetics, transmission-line theory, field solvers, simulation tools, or package/PCB design tools.
Pay
$191,800.00 - $287,800.00 (base salary)
Tools
DDR, SerDes, PCIe Gen-x, USB, UFS, Matlab, HFSS, Q3D
AI focus
Ability to use AI to enhance team efficiency is preferred.
Model-written summary · the original posting is authoritative