Qualcomm
Principal IC Packaging Engineer
$210K–$315K
San Diego, California · On-site · Principal · Full-time · Posted Sep 17, 2026
- Experience
- Minimum: 8+ years with a bachelor's degree, 7+ with a master's degree, or 6+ with a PhD in relevant System/Package Design/Technology Engineering or related work. Preferred: 17 or more years in packaging technology development, especially 2.5D/3D and related disciplines.
- Education
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field; alternatives are a master's degree or PhD in those fields or a related field. Preferred: M.S. or Ph.D. in Mechanical, Electrical, or Materials Engineering, or equivalent experience.
About the job
Leads development and manufacturing introduction of advanced IC packaging technologies, from concept through high-volume production, with a focus on Data Center AI, power management, and emerging markets.
What you'll do
- Lead development of advanced packaging technologies and oversee new product introductions through high-volume manufacturing.
- Manage foundry and OSAT relationships, cross-functional teams, and multiple concurrent programs.
- Resolve technical issues and guide package architecture, design, assembly, reliability, and cost decisions.
What they ask for
- Bachelor's degree in Chemical, Electrical, or Mechanical Engineering or a related field, plus 8+ years of relevant experience; OR a master's degree plus 7+ years; OR a PhD plus 6+ years.
- Hands-on expertise in advanced packaging methods, processes, materials, equipment, and design rules.
- Ability to lead multidisciplinary teams and manage multiple programs.
- Experience with package architecture, high-density interconnect design, and performance, reliability, and cost constraints.
Nice to have
- M.S. or Ph.D. in Mechanical, Electrical, or Materials Engineering, or equivalent experience.
- Familiarity working with contract manufacturers on data center and rack design.
Pay
$210,000.00 - $315,000.00 (base salary)
Tools
RDL, wafer bonding, flip chip, wire bond, SiP, 3D, 2.5D, FCBGA
AI focus
Develops advanced packaging technologies targeting Data Center AI products.
Model-written summary · the original posting is authoritative