Qualcomm
Principal Thermal Engineer
$210K–$315K
San Diego, California · On-site · Principal · Full-time · Posted Oct 26, 2026
- Experience
- 8+ years with a bachelor’s degree, 7+ years with a master’s degree, or 6+ years with a PhD in System/Package Design/Technology Engineering or related work. Preferred: 10+ years in electronics cooling.
- Education
- Bachelor’s, master’s, or PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field.
About the job
Leads thermal architecture, simulation, testing, and optimization for Qualcomm AI computing platforms from concept through production.
What you'll do
- Develop thermal architecture solutions using simulation and testing, and coordinate with stakeholders on technical tradeoffs and design reviews.
- Run CFD simulations and thermal tests, validate models, and analyze and document results.
- Present findings and recommendations to technical and non-technical stakeholders.
What they ask for
- Bachelor’s degree in Chemical, Electrical, or Mechanical Engineering, or related field, and 8+ years of relevant experience; or a master’s degree and 7+ years; or a PhD and 6+ years.
- Experience in System/Package Design/Technology Engineering or related work.
Nice to have
- 10+ years of electronics-cooling industry experience, particularly in high-performance computing, AI, or data center products.
- Experience with high-power compute thermal solutions, semiconductor packaging, CFD tools, thermal validation, and scripting/programming.
Pay
$210,000.00 - $315,000.00 USD base salary
Tools
CFD, ANSYS Icepak, Celsius EC, Flotherm, Python, C/C++, MATLAB
AI focus
Thermal engineering for AI computing platforms, including the Qualcomm Dragonfly™ AI300 platform and future platforms; preferred familiarity with AI/ML workloads and accelerator architectures.
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