Qualcomm
Server Structural FEA Engineer
$190K–$285K
Santa Clara, California · On-site · Full-time · Posted Oct 29, 2026
- Experience
- 10+ years of advanced FEA experience. The posting also lists separate minimum qualifications: bachelor’s plus 6+ years, master’s plus 5+ years, or PhD plus 4+ years in Systems Engineering or related work.
- Education
- Master’s degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or a related field.
About the job
Leads structural and thermo-mechanical FEA of server SoCs and semiconductor packages, assessing package-to-platform reliability and translating results into design guidance.
What you'll do
- Develop FEA methods and reliability/life-prediction models for package assembly, warpage, stress, interconnects, and other failure mechanisms.
- Analyze package interactions with PCBs, sockets, retention systems, cooling solutions, and thermal interface materials; validate models against measurements and tests.
- Create scalable workflows and communicate design recommendations to cross-functional engineering teams.
What they ask for
- 10+ years of advanced FEA experience in semiconductor packaging, microelectronics assembly, CPI, structural reliability, and interconnect technologies.
- Master’s degree in a related field.
- Experience modeling semiconductor-package failure mechanisms and correlating simulations with experimental, manufacturing, or qualification data.
- Proficiency in ANSYS Workbench, ANSYS APDL, ABAQUS, or equivalent nonlinear FEA tools.
Nice to have
- Ph.D. in a related field.
- Experience developing APDL automation, reusable workflows, modeling standards, and BKMs.
Pay
$190,200.00 - $285,400.00 USD base salary
Tools
ANSYS Workbench, ANSYS APDL, ABAQUS
Model-written summary · the original posting is authoritative