Qualcomm
Sr Staff or Principal Thermal Engineer, Server Packaging (San Diego)
$192K–$288K
San Diego, California · On-site · Senior Staff · Full-time · Posted Sep 17, 2026
- Experience
- 10+ years of industry experience in electronics cooling related to server products.
- Education
- MS in Mechanical Engineering; PhD in Mechanical Engineering preferred.
About the job
Develop thermal solutions for server products at package and system levels, using simulation and testing to address thermal management challenges.
What you'll do
- Lead thermal architecture through simulation and testing; conduct design reviews and present findings to stakeholders.
- Perform CFD simulations and thermal tests, then analyze and document results.
- Develop custom software to automate thermal modeling and testing.
What they ask for
- 10+ years of industry experience in electronics cooling related to server products.
- Expertise in CFD simulations and proficiency with ANSYS-Icepak and Celsius EC.
- Ability to design and execute laboratory thermal tests and use airflow and temperature measurement equipment.
- Ability to write scripts for data analysis and tool development; strong presentation, negotiation, and communication skills.
Nice to have
- Industry exposure to 2.5/3D packaging.
- Experience with AI/ML concepts, algorithms, and methodologies; experience with 3D CAD tools such as Solidworks or Creo.
Pay
$191,800.00 - $287,800.00 USD base salary
Tools
CFD, ANSYS-Icepak, Celsius EC, Python, C/C++, MATLAB, Solidworks, Creo
AI focus
AI/ML experience is a plus; the posting does not specify AI-focused job duties.
Model-written summary · the original posting is authoritative