Drimva

Qualcomm

Staff Failure Analysis Engineer - Advanced Packaging Technologies

$141K–$212K

San Diego, California · On-site · Staff · Full-time · Posted Sep 17, 2026

Experience
4+ years with a bachelor’s degree, 3+ years with a master’s degree, or 2+ years with a PhD in Hardware Engineering or related work.
Education
Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field; alternatively, a master’s degree or PhD in those fields. Preferred: Master’s degree in Electrical Engineering or related discipline.

About the job

Leads development and deployment of failure-analysis test interfaces, sockets, carrier boards, and thermal solutions to support electrical fault isolation and product debug across Qualcomm product lines.

What you'll do

  • Develop and deploy FA-specific hardware for ATE-based and platform-based testing, with hardware ready by Silicon on Dock (SOD).
  • Design and evaluate thermal management solutions and use thermal and electrical analysis tools to assess FA hardware.
  • Develop hardware specifications and coordinate with internal teams and suppliers to integrate solutions into FA workflows.

What they ask for

  • Bachelor’s degree in a related field and 4+ years of Hardware Engineering or related work experience; or a master’s degree and 3+ years; or a PhD and 2+ years.
  • Strong foundation in electrical engineering and hands-on experience in hardware design, test interfaces, or FA enablement.
  • Understanding of socketing technologies, power delivery challenges, and signal integrity for advanced semiconductor packages.
  • Experience supporting FA or debug for complex SoCs, high-pin-count devices, or large advanced packages.

Nice to have

  • Familiarity with thermal analysis and mitigation techniques for high-power semiconductor devices.
  • Master’s degree in Electrical Engineering or related discipline.

Pay

$141,300.00 - $211,900.00 USD base salary

Tools

ATE, custom sockets, carrier boards, thermal management solutions, thermal and electrical analysis tools

Model-written summary · the original posting is authoritative

First seen Oct 28, 2026 · Last verified Nov 5, 2026 (UTC)