Samsung
Hybrid C2C - BEOL Module Integration Engineer
$106K–$145K
12100 Samsung Blvd, Austin, TX, USA · On-site · Full-time · Posted Oct 1, 2026
- Experience
- 5+ years of Far BEOL Process/Module Integration in semiconductor manufacturing plus 3+ years of Bonding experience required; 10+ years of Process/Module Integration highly preferred.
- Education
- Bachelor’s degree or higher in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or related field.
About the job
Leads development, optimization, and manufacturing integration of copper-to-copper bonding and far-BEOL processes for next-generation CMOS image sensors.
What you'll do
- Own bonding and far-BEOL module integration, systematic yield and reliability issues, and critical-dimension targeting and variation control.
- Lead projects to resolve systematic issues or improve their detection.
- Review factory process changes and provide yield-risk assessments and failure modeling for incidents.
What they ask for
- Bachelor’s degree or higher in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related field.
- 5+ years of Far BEOL Process/Module Integration in semiconductor manufacturing and 3+ years of Bonding experience.
- Expert understanding of the assigned process flow and how process affects yield, product performance, and reliability.
Nice to have
- 10+ years of experience in Process/Module Integration.
- Prior knowledge of fab unit processes, including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, and CMP.
Pay
$106,000.00 - $145,000.00 USD base salary
Tools
Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP
Model-written summary · the original posting is authoritative