Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)

What you'll do

• Build and calibrate CFD reference models and extend compact thermal models, validating accuracy in steady-state and transient conditions.
• Improve solver performance and run workload-driven simulations to identify hotspots and assess thermal-aware policies and cooling options.
• Couple thermal models with power simulations, document methods and results, and present findings to engineering teams and lab leadership.

What they ask for

• Pursuing a PhD or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Applied Physics, or a related field; at least one academic quarter/semester remaining.
• Strong foundation in heat transfer, especially transient conduction in multi-layer solids and thermal contact resistance.
• Hands-on experience with numerical methods (finite-volume, finite-element, or finite-difference) and scientific programming in Python and/or MATLAB.
• Ability to critically assess simulation results, including mesh convergence, boundary conditions, and energy balance, and explain model discrepancies.

Nice to have

• Experience with Simcenter Flotherm, Ansys Icepak/Fluent, or COMSOL; compact or reduced-order thermal models, model-order reduction, or ML surrogates.
• Background in electronics packaging, 3D-IC / chiplet thermal management, advanced cooling, HPC, sparse linear solvers, or GPU programming.

Pay

$28—$68 USD hourly base pay rate

Tools

Simcenter Flotherm, Python, MATLAB, Ansys Icepak/Fluent, COMSOL

AI focus

Thermal modeling and simulation for AI memory systems, including simulations driven by AI workload traces and potential machine-learning surrogates for physical simulation.