SiTime
Director, Advanced AI Marketing and Business Development
$179K–$256K
California, Santa Clara · Director · Full-time · Posted Oct 15, 2026
- Experience
- 15+ years; in product marketing, product management, product line management, or strategic business leadership within the semiconductor industry.
- Education
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related technical discipline.
About the job
Leads product marketing and business development to identify, validate, and develop new SiTime precision-timing opportunities across advanced AI markets and applications.
What you'll do
- Identify new advanced AI applications and build customer and ecosystem relationships to develop business opportunities.
- Translate customer and system requirements into product concepts, roadmap priorities, business cases, and go-to-market plans.
- Position SiTime timing solutions in emerging AI system and packaging architectures, and develop customer-facing and thought-leadership materials.
What they ask for
- 15+ years of experience in product marketing, product management, product line management, or strategic business leadership within the semiconductor industry.
- Director-level experience driving product strategy, roadmaps, go-to-market execution, business planning, and customer engagement.
- Experience developing semiconductor applications in advanced AI, high-performance computing, edge AI, automotive, robotics, drones, autonomous systems, or adjacent markets.
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical discipline.
Nice to have
- Experience with timing, clocking, synchronization, IEEE 1588, SyncE, networking, or communications infrastructure technologies.
- MBA or advanced technical degree.
Pay
$179,280 USD — $256,370 USD (base salary)
Tools
IEEE 1588, SyncE, 2.5D, 3D integration, interposers, package substrates, co-packaged architectures, Vertical Timing Delivery
AI focus
Develops new precision-timing opportunities for AI datacenters and infrastructure, edge AI, automotive AI, robotics, drones, autonomous systems, and emerging AI platforms, including advanced packaging and AI system architectures.
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