SK hynix
Advanced Package Design Engineer
$110K–$155K
San Jose, CA +1 · Full-time · Posted Feb 11, 2026
- Location
- San Jose, CA
San Jose, California, United States - Experience
- 3+ years of experience in semiconductor package design or layout; 5+ years in advanced packaging layout design is preferred.
- Education
- Bachelor’s or Master’s degree in Electrical Engineering (preferred), Mechanical Engineering, Material Science, or a related field.
- Visa sponsorship
- The company participates in the federal E-Verify program; newly hired employees must complete Form I-9 verifying identity and legal authorization to work in the United States.
About the job
Designs and optimizes silicon and organic interposers for advanced chiplet packaging, coordinating with cross-functional teams to deliver manufacturable package solutions.
What you'll do
- Design silicon and organic interposers and create and verify advanced package layouts.
- Analyze advanced packaging options and maintain layout rules, stack-ups, and guidelines.
- Collaborate with internal and external stakeholders on packaging technology development.
What they ask for
- Experience with Virtuoso/APD, Synopsys Custom Compiler, or Siemens Xpedition.
- Understanding of high-speed signal routing and power distribution networks (PDN).
- Familiarity with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies.
- Effective communication skills and ability to work in a fast-paced, cross-functional environment.
Nice to have
- Currently pursuing a PhD in Electrical Engineering or a related field.
- Experience with SI/PI simulation tools such as Ansys, HFSS, or ADS; advanced packaging layout experience of 5+ years is also preferred.
Pay
$110,000 — $155,000 USD (base salary)
Tools
Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition, Ansys, HFSS, ADS
Model-written summary · the original posting is authoritative