Drimva

Substrate

Mechanical Engineer

$150K–$275K

San Francisco · On-site · Full-time · Posted Oct 28, 2025

Experience
6+ years hands-on mechanical engineering experience; 3+ years in precision manufacturing or research environments at technology companies.
Education
Bachelor's degree in Mechanical Engineering or related technical field.
Visa sponsorship
Applicants must be legally authorized to work in the United States. This position is not eligible for visa sponsorship.

About the job

Designs and develops UHV systems, precision mechanisms, and high-speed motion systems for production and research environments.

What you'll do

  • Design UHV-compatible mechanical systems and nanometer-precision mechatronics; perform structural, vibration, thermal, and FEA analyses.
  • Develop vacuum assemblies and wafer-handling robotics, then test and validate system performance.
  • Troubleshoot deployed systems and support manufacturing, vendors, and external-site installations.

What they ask for

  • 6+ years of hands-on mechanical engineering experience, including 3+ years in precision manufacturing or research environments at technology companies.
  • Expert-level CAD experience designing complex precision assemblies and UHV-compatible components.
  • Direct FEA experience for stress/strain calculations in high-acceleration mechatronic applications; strong vacuum technology, UHV design, and vacuum-compatible materials background.
  • Experience building precision mechanical systems from concept through production; Bachelor's degree in Mechanical Engineering or a related technical field.

Nice to have

  • Knowledge or experience with semiconductor wafer-handling robotics or equipment.
  • Experience with nanometer-precision actuators, vibration damping, or work in national labs, semiconductor equipment, or custom vacuum system design companies.

Pay

$150,000-$275,000 USD

Tools

CAD, FEA, UHV, vacuum technology, wafer handling robotics, nanometer-precision actuators

Model-written summary · the original posting is authoritative

First seen Oct 29, 2026 · Last verified Nov 4, 2026 (UTC)