Drimva

Syenta

Process Engineer (Metallization)

$100K–$130K

Tempe, 85280, US · Full-time · Posted Jul 6, 2026

Experience
5+ years of hands-on experience in electroplating or electrochemical process development.
Education
B.S., M.S., or Ph.D. or equivalent industry experience in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering.

About the job

Develop and optimize Syenta’s electroplating processes for its Localised Electrochemical Manufacturing platform, translating experimental results into repeatable manufacturing workflows.

What you'll do

  • Develop electrolyte chemistries and optimize deposition conditions, film properties, and process repeatability.
  • Design and run experiments, investigate plating defects, and implement process improvements.
  • Scale laboratory processes toward manufacturing, support process transfers, and collaborate with materials, hardware, and product teams.

What they ask for

  • B.S., M.S., or Ph.D. or equivalent industry experience in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering.
  • 5+ years of hands-on experience in electroplating or electrochemical process development.
  • Strong experience with copper electroplating or similar metal deposition systems; background in semiconductor manufacturing, advanced packaging, or related high-precision industries.
  • Experience in laboratory and/or cleanroom environments; proven process and defect problem-solving, experimental design, and data analysis capabilities.

Nice to have

  • Experience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environments, or scaling processes from R&D to manufacturing.
  • Familiarity with SEM, profilometry, or electrical testing; experience with prototype hardware or relevant adjacent industries.

Pay

US $100k – $130k (negotiable) (base salary)

Tools

Localised Electrochemical Manufacturing (LEM), electroplating, electrochemistry, DOE, SEM, profilometry

Model-written summary · the original posting is authoritative

First seen Oct 30, 2026 · Last verified Nov 4, 2026 (UTC)