Syenta
Senior Process Engineer – Substrate
Tempe, 85280, US · Senior · Full-time · Posted Sep 22, 2026
- Experience
- Minimum 7 years; 10+ years preferred.
- Education
- Bachelor’s degree in a stated related field; Master’s or PhD preferred.
About the job
Develop and optimize substrate and wafer-level microfabrication processes for Syenta’s advanced semiconductor packaging tools, translating prototypes into scalable manufacturing processes.
What you'll do
- Develop PID coating, patterning, and multilayer build-up processes; support transfer to scalable manufacturing.
- Execute and troubleshoot microfabrication, including photolithography, etching, deposition, wet processing, and metrology.
- Analyze process data, assess quality and reproducibility, and collaborate on prototypes and process improvements.
What they ask for
- Bachelor’s degree in physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
- Minimum 7 years of combined microfabrication experience with cleanroom proficiency and ability to support process integration.
- Hands-on experience with photoresist coating, exposure, and development tools and processes; knowledge of PID materials for interposer buildup.
- Experience with etching (ICP, RIE, CCP, and wet etching) and metallization/thin-film deposition (PECVD, PVD, etc.).
Nice to have
- Master’s or PhD in a related field.
- 10+ years of combined microfabrication experience; semiconductor industry experience, particularly advanced packaging or interposer/substrate build-up.
Tools
PID, PV-FX2 HR200, photolithography, ICP, RIE, CCP, PECVD, PVD
Model-written summary · the original posting is authoritative