Drimva

Tenstorrent

High Speed AI Interconnect Signal Integrity Engineer

$100K–$500K

Austin, Texas, United States +6 · Full-time · Posted Mar 4, 2026

Location
Austin, Texas, United States
Santa Clara, California, United States
Toronto, Ontario, Canada
Austin, Texas, United States
Boston, Massachusetts, United States
Santa Clara, California, United States
Toronto, Ontario, Canada
Experience
5+ years; candidates at various experience levels are welcome and will be assessed for an appropriate level.
Education
Bachelor’s or Master’s in Electrical Engineering.
Visa sponsorship
Employment is contingent on eligibility to access U.S. export-controlled technology; depending on citizenship/permanent residency status, prior license approval may be required.

About the job

Designs and validates high-bandwidth copper and optical interconnects for large-scale AI training and inference systems.

What you'll do

  • Define interconnect architectures, requirements, topologies, and validation strategies for AI clusters.
  • Analyze link and channel budgets, including loss, jitter, eye margin, and BER across operating conditions and aging.
  • Lead qualification and reliability testing, and coordinate with interconnect suppliers on roadmaps.

What they ask for

  • Bachelor’s or Master’s in Electrical Engineering.
  • 5+ years working on high-speed communications (100G–1.6T), including signal integrity, channels, and links.
  • Experience with SI tools and lab equipment, such as Keysight ADS, VNAs, TDRs, BERTs, and protocol analyzers.
  • Familiarity with cable specification and testing, accelerated life testing, mating life, and failure analysis.

Nice to have

  • Manufacturing/DFM/DTM experience.

Pay

$100k - $500k (USD, including base and variable compensation targets; not specified as base salary or total pay)

Tools

Keysight ADS, VNAs, TDRs, BERTs

AI focus

Design and validate interconnects for large-scale AI inference and training clusters.

Model-written summary · the original posting is authoritative

First seen Oct 10, 2026 · Last verified Nov 5, 2026 (UTC)