Drimva

Tenstorrent

Signal Integrity Engineer

$100K–$500K

Austin, Texas, United States +4 · Full-time · Posted Mar 27, 2026

Location
Austin, Texas, United States
Boston, Massachusetts, United States
Santa Clara, California, United States
Toronto, Ontario, Canada
Santa Clara, California, United States
Experience
5+ years; candidates at various experience levels are welcome, with level assessed during interviews.
Education
Bachelor’s degree in Electrical Engineering or equivalent.
Visa sponsorship
Employment is contingent on eligibility to access U.S. export-controlled technology. Depending on citizenship/permanent residency status, prior license approval may be required; offers may be rescinded if employment is not possible under U.S. export laws.

About the job

Designs and validates high-speed interconnects and breakout structures, supporting signal and power integrity from simulation through hardware bring-up and failure analysis.

What you'll do

  • Design, extract, simulate, and validate breakout structures and board models for signal and power integrity.
  • Support design sign-off with packaging, ODM, and layout teams; create specifications and help adopt new interconnect and packaging technologies.
  • Participate in design reviews and support post-silicon bring-up, troubleshooting, and documentation or knowledge sharing.

What they ask for

  • Bachelor’s degree in Electrical Engineering or equivalent.
  • 5+ years working in high-speed digital design focused on high-speed PCB or package design at 10Gbps and above.
  • Knowledge of high-speed performance metrics including ICR, ERL, COM, NEXT, and FEXT, and high-speed connector technologies.
  • Proficiency with PCB ECAD tools.

Nice to have

  • Cadence Allegro proficiency.

Pay

$100k - $500k (total pay, including base and variable compensation targets)

Tools

Cadence Allegro, 100GbE, GDDR6, PCIe Gen5+, ICR, ERL, COM, NEXT

Model-written summary · the original posting is authoritative

First seen Oct 10, 2026 · Last verified Nov 5, 2026 (UTC)