Drimva

Tenstorrent

Top Level Physical Design Engineer

$100K–$500K

Austin, Texas, United States +5 · Full-time · Posted Apr 16, 2026

Location
Austin, Texas, United States
Fort Collins, Colorado, United States
Santa Clara, California, United States
Austin, Texas, United States
Fort Collins, Colorado, United States
Santa Clara, California, United States
Experience
8+ years; the posting also welcomes candidates at various experience levels, who will be assessed for the appropriate level.
Visa sponsorship
Employment is contingent on eligibility to access U.S. export-controlled technology; some candidates may need prior U.S. Commerce Department or applicable federal agency license approval.

About the job

Drives top-level physical implementation and chip-level design closure for complex AI accelerator and CPU system-on-chip designs.

What you'll do

  • Implement full-chip floorplans, power grids, and clock networks.
  • Drive timing closure, EM/IR analysis, and physical verification at the chip level.
  • Collaborate with architecture, RTL, and packaging teams on physical design.

What they ask for

  • 8+ years of top-level SOC physical design experience on complex, multi-million gate designs.
  • Expertise in hierarchical floorplanning, fabric implementation, power grid design, and global clock distribution.
  • Experience with bump planning, RDL implementation, and multi-voltage domain designs.
  • Mastery of timing closure, EM/IR analysis, and chip-level physical verification.

Pay

$100k - $500k including base and variable compensation targets (base salary and variable compensation; no separate ranges stated)

Tools

RISC-V

AI focus

Physical design of AI accelerators and AI/CPU SoCs.

Model-written summary · the original posting is authoritative

First seen Oct 10, 2026 · Last verified Nov 6, 2026 (UTC)